More Pictures
Due to a design defect, we had to manually separate a trace from teh copper area underneath the pads on each board we used.
A photo of our first board, demonstrating the relative position of the PIC and other devices.
Likewise, these transistors had to be reoriented into the correct manner after being soldered down.
The underside, complete with little rubber legs for grip and stability.
Alexandr Pshenichkin and Cortland Setlow
Swarthmore College